TY - GEN
T1 - Miniaturization of LTCC devices by using mixed dielectric substrates
AU - Baker, Amanda
AU - Lanagan, Michael T.
AU - Semouchkina, Elena
AU - Semouchkin, George
AU - Kerr, Thomas
PY - 2007/12/1
Y1 - 2007/12/1
N2 - Low Temperature Cofired Ceramic (LTCC) materials systems and other dielectric materials have been used to fabricate a series of miniaturized, high frequency devices. This paper outlines the materials and the strategy for their combination that we have used to achieve miniaturization and unique device function. A general concept that has been applied to device miniaturization is to place high and low dielectric constant materials locally within the structure taking into account electromagnetic field distribution at frequencies of device operation. Co-firing high and low permittivity materials provides unique challenges to match sintering shrinkage and chemical compatibility. Examples of prototype microwave devices will be presented, with emphasis on device modeling and design, prototype construction methods, and electrical test results.
AB - Low Temperature Cofired Ceramic (LTCC) materials systems and other dielectric materials have been used to fabricate a series of miniaturized, high frequency devices. This paper outlines the materials and the strategy for their combination that we have used to achieve miniaturization and unique device function. A general concept that has been applied to device miniaturization is to place high and low dielectric constant materials locally within the structure taking into account electromagnetic field distribution at frequencies of device operation. Co-firing high and low permittivity materials provides unique challenges to match sintering shrinkage and chemical compatibility. Examples of prototype microwave devices will be presented, with emphasis on device modeling and design, prototype construction methods, and electrical test results.
UR - http://www.scopus.com/inward/record.url?scp=84878261346&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84878261346&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84878261346
SN - 9781605603872
T3 - International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
SP - 134
EP - 137
BT - International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
T2 - 3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Y2 - 23 April 2007 through 26 April 2007
ER -