Miniaturization of LTCC devices by using mixed dielectric substrates

Amanda Baker, Michael T. Lanagan, Elena Semouchkina, George Semouchkin, Thomas Kerr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Low Temperature Cofired Ceramic (LTCC) materials systems and other dielectric materials have been used to fabricate a series of miniaturized, high frequency devices. This paper outlines the materials and the strategy for their combination that we have used to achieve miniaturization and unique device function. A general concept that has been applied to device miniaturization is to place high and low dielectric constant materials locally within the structure taking into account electromagnetic field distribution at frequencies of device operation. Co-firing high and low permittivity materials provides unique challenges to match sintering shrinkage and chemical compatibility. Examples of prototype microwave devices will be presented, with emphasis on device modeling and design, prototype construction methods, and electrical test results.

Original languageEnglish (US)
Title of host publicationInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Pages134-137
Number of pages4
StatePublished - Dec 1 2007
Event3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007 - Denver, CO, United States
Duration: Apr 23 2007Apr 26 2007

Publication series

NameInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Other

Other3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Country/TerritoryUnited States
CityDenver, CO
Period4/23/074/26/07

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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