TY - GEN
T1 - Minimizing simultaneous switching noise at reduced power with power transmission lines for high-speed signaling
AU - Telikepalli, Satyanarayana
AU - Swaminathan, Madhavan
AU - Keezer, David
PY - 2012
Y1 - 2012
N2 - Signal and power integrity are crucial for ensuring high performance in high speed digital systems. As the operating frequency of digital systems increases, the power and ground bounce created by simultaneous switching noise (SSN) has become a limiting factor for the performance of these devices. SSN is caused by parasitic inductance that exists in the power delivery network (PDN), and voltage fluctuations on the power and ground rails can lead to reduced noise margins and can limit the maximum frequency of a digital device. A new PDN design has been suggested that achieves significantly reduced SSN [1] by replacing the power plane structure with a power transmission line (PTL). In this paper, a new power delivery scheme is shown to significantly reduce switching noise at lower power. This concept has been demonstrated through theory, simulation, and measurements.
AB - Signal and power integrity are crucial for ensuring high performance in high speed digital systems. As the operating frequency of digital systems increases, the power and ground bounce created by simultaneous switching noise (SSN) has become a limiting factor for the performance of these devices. SSN is caused by parasitic inductance that exists in the power delivery network (PDN), and voltage fluctuations on the power and ground rails can lead to reduced noise margins and can limit the maximum frequency of a digital device. A new PDN design has been suggested that achieves significantly reduced SSN [1] by replacing the power plane structure with a power transmission line (PTL). In this paper, a new power delivery scheme is shown to significantly reduce switching noise at lower power. This concept has been demonstrated through theory, simulation, and measurements.
UR - http://www.scopus.com/inward/record.url?scp=84874471510&partnerID=8YFLogxK
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U2 - 10.1109/EPEPS.2012.6457836
DO - 10.1109/EPEPS.2012.6457836
M3 - Conference contribution
AN - SCOPUS:84874471510
SN - 9781467325394
T3 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
SP - 29
EP - 32
BT - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
T2 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Y2 - 21 October 2012 through 24 October 2012
ER -