Model-order estimation and reduction of distributed interconnects via improved vector fitting

Sung Hwan Min; Heeseok Lee; Eunseok Song; Yun Seok Choi; Tae Je Cho; Sa Yoon Kang; Se Yong Oh; Madhavan Swaminathan

doi:10.1109/EPEP.2005.1563696

Model-order estimation and reduction of distributed interconnects via improved vector fitting

Sung Hwan Min
, Heeseok Lee
, Eunseok Song
, Yun Seok Choi
, Tae Je Cho
, Sa Yoon Kang
, Se Yong Oh
, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

This paper introduces an automated method estimating and reducing the order of macromodel for fast transient simulation. The proposed method improves the vector fitting algorithm for extracting the reduced-order macromodel from the accurate macromodel having redundant poles and residues. The performance of the proposed method has been demonstrated through several test cases.

Original language	English (US)
Title of host publication	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages	43-46
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2005.1563696
State	Published - 2005
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States Duration: Oct 24 2005 → Oct 26 2005

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume	2005

Conference

Conference	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/Territory	United States
City	Austin, TX
Period	10/24/05 → 10/26/05

All Science Journal Classification (ASJC) codes

General Engineering

Access to Document

10.1109/EPEP.2005.1563696

Cite this

Min, S. H., Lee, H., Song, E., Choi, Y. S., Cho, T. J., Kang, S. Y., Oh, S. Y., & Swaminathan, M. (2005). Model-order estimation and reduction of distributed interconnects via improved vector fitting. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 (pp. 43-46). Article 1563696 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005). https://doi.org/10.1109/EPEP.2005.1563696

@inproceedings{35e69b977d7f4701a9cbfcc4d2dbf13a,

title = "Model-order estimation and reduction of distributed interconnects via improved vector fitting",

abstract = "This paper introduces an automated method estimating and reducing the order of macromodel for fast transient simulation. The proposed method improves the vector fitting algorithm for extracting the reduced-order macromodel from the accurate macromodel having redundant poles and residues. The performance of the proposed method has been demonstrated through several test cases.",

author = "Min, \{Sung Hwan\} and Heeseok Lee and Eunseok Song and Choi, \{Yun Seok\} and Cho, \{Tae Je\} and Kang, \{Sa Yoon\} and Oh, \{Se Yong\} and Madhavan Swaminathan",

year = "2005",

doi = "10.1109/EPEP.2005.1563696",

language = "English (US)",

isbn = "0780392205",

series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

pages = "43--46",

booktitle = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005",

note = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 ; Conference date: 24-10-2005 Through 26-10-2005",

}

Min, SH, Lee, H, Song, E, Choi, YS, Cho, TJ, Kang, SY, Oh, SY & Swaminathan, M 2005, Model-order estimation and reduction of distributed interconnects via improved vector fitting. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005., 1563696, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, vol. 2005, pp. 43-46, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, Austin, TX, United States, 10/24/05. https://doi.org/10.1109/EPEP.2005.1563696

Model-order estimation and reduction of distributed interconnects via improved vector fitting. / Min, Sung Hwan; Lee, Heeseok; Song, Eunseok et al.
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 43-46 1563696 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Model-order estimation and reduction of distributed interconnects via improved vector fitting

AU - Min, Sung Hwan

AU - Lee, Heeseok

AU - Song, Eunseok

AU - Choi, Yun Seok

AU - Cho, Tae Je

AU - Kang, Sa Yoon

AU - Oh, Se Yong

AU - Swaminathan, Madhavan

PY - 2005

Y1 - 2005

N2 - This paper introduces an automated method estimating and reducing the order of macromodel for fast transient simulation. The proposed method improves the vector fitting algorithm for extracting the reduced-order macromodel from the accurate macromodel having redundant poles and residues. The performance of the proposed method has been demonstrated through several test cases.

AB - This paper introduces an automated method estimating and reducing the order of macromodel for fast transient simulation. The proposed method improves the vector fitting algorithm for extracting the reduced-order macromodel from the accurate macromodel having redundant poles and residues. The performance of the proposed method has been demonstrated through several test cases.

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DO - 10.1109/EPEP.2005.1563696

M3 - Conference contribution

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SN - 0780392205

SN - 9780780392205

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

SP - 43

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BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

Y2 - 24 October 2005 through 26 October 2005

ER -

Model-order estimation and reduction of distributed interconnects via improved vector fitting

Abstract

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Conference

All Science Journal Classification (ASJC) codes

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