@inproceedings{a3352c8e03f543109d0fbbd738d90ca4,
title = "Modeling and design of system-in-package integrated voltage regulator with thermal effects",
abstract = "This paper demonstrates a new approach to model the impact of thermal effects on the efficiency of integrated voltage regulators (IVRs) by combining analytical efficiency evaluations with coupled electrical and thermal simulations. An application of the approach shows that a system-in-package solution avoids thermal problems typically observed in other IVR designs. While the evaluation in this paper focuses on the thermal impact on loss in the inductor wiring and the PDN, the developed approach is general enough to also model thermal impacts on the power dissipation in the inductor cores and the buck converter chip.",
author = "S. Mueller and Davis, {A. K.} and Bellaredj, {M. L.F.} and A. Singh and Ahmed, {K. Z.} and M. Kar and S. Mukhopadhyay and Kohl, {P. A.} and M. Swaminathan and Y. Wang and J. Wong and S. Bharathi and Y. Mano and A. Beece and B. Fasano and Moghadam, {H. Fathi} and D. Draper",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016 ; Conference date: 23-10-2016 Through 26-10-2016",
year = "2017",
month = jan,
day = "26",
doi = "10.1109/EPEPS.2016.7835419",
language = "English (US)",
series = "2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "65--67",
booktitle = "2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016",
address = "United States",
}