Modeling and mixed signal simulation of embedded passive components in high performance packages

A. Sood, K. L. Choi, A. Haridass, N. Na, M. Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

This paper discusses two approaches for mixed signal simulation in SPICE: (1) use of RF design kits; and (2) macromodeling. RF design kits enable synchronization of physical layouts, schematics, and electrical models, in a LIBRA design environment that provide SPICE compatibility through equivalent circuits. Macromodeling, however, provides a high level representation of the passive components or circuits and enables compatibility with SPICE and full electromagnetic simulators. Macromodels could then be used to build scalable models for the design kit. Both methods are examined using embedded capacitors and resistors fabricated using low temperature cofired ceramic technology. Simulations are compared to time domain measurements.

Original languageEnglish (US)
Title of host publicationProceedings - 1998 International Conference on Multichip Modules and High Density Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages506-511
Number of pages6
ISBN (Electronic)0780348508, 9780780348509
DOIs
StatePublished - 1998
Event7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 - Denver, United States
Duration: Apr 17 1998 → …

Publication series

NameProceedings - 1998 International Conference on Multichip Modules and High Density Packaging
Volume1998-April

Conference

Conference7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998
Country/TerritoryUnited States
CityDenver
Period4/17/98 → …

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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