@inproceedings{949885ccf8664cfeaced4d8bc7702a0d,
title = "Modeling and mixed signal simulation of embedded passive components in high performance packages",
abstract = "This paper discusses two approaches for mixed signal simulation in SPICE: (1) use of RF design kits; and (2) macromodeling. RF design kits enable synchronization of physical layouts, schematics, and electrical models, in a LIBRA design environment that provide SPICE compatibility through equivalent circuits. Macromodeling, however, provides a high level representation of the passive components or circuits and enables compatibility with SPICE and full electromagnetic simulators. Macromodels could then be used to build scalable models for the design kit. Both methods are examined using embedded capacitors and resistors fabricated using low temperature cofired ceramic technology. Simulations are compared to time domain measurements.",
author = "A. Sood and Choi, {K. L.} and A. Haridass and N. Na and M. Swaminathan",
note = "Publisher Copyright: {\textcopyright} 1998 IEEE.; 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 ; Conference date: 17-04-1998",
year = "1998",
doi = "10.1109/ICMCM.1998.670832",
language = "English (US)",
series = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "506--511",
booktitle = "Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging",
address = "United States",
}