TY - JOUR
T1 - Modeling and simulation of core switching noise for ASICs
AU - Na, Nju
AU - Choi, Jinwoo
AU - Swaminathan, Madhavan
AU - Libous, James P.
AU - O'Connor, Daniel P.
N1 - Funding Information:
Manuscript received August 16, 2001; revised November 21, 2001. This work was supported by the Semiconductor Research Corporation under Contract 99-NJ-735. N. Na is with the Agilent Technologies, San Jose, CA 95131 USA (e-mail: [email protected]). J. Choi and M. Swaminathan are with the Georgia Institute of Technology, Atlanta, GA 30332 USA (e-mail: [email protected]). J. P. Libous and D. P. O’Connor are with IBM Microelectronics, Endicott, NY 13760 USA. Publisher Item Identifier S 1521-3323(02)02239-6.
PY - 2002/2
Y1 - 2002/2
N2 - This paper presents simulation and analysis of core switching noise for a CMOS ASIC test vehicle. The test vehicle consists of a ceramic ball grid array (CBGA) package on a printed circuit board (PCB). The entire test vehicle has been modeled by accounting for all the plane resonances using the cavity resonator method. The models included both the on-chip and off-chip decoupling capacitors. Using both time domain and frequency domain simulations, the role of plane resOnances on power supply noise for fast current edge rates has been discussed. The models have been constructed to amplify certain parts of the test vehicle during simulations.
AB - This paper presents simulation and analysis of core switching noise for a CMOS ASIC test vehicle. The test vehicle consists of a ceramic ball grid array (CBGA) package on a printed circuit board (PCB). The entire test vehicle has been modeled by accounting for all the plane resonances using the cavity resonator method. The models included both the on-chip and off-chip decoupling capacitors. Using both time domain and frequency domain simulations, the role of plane resOnances on power supply noise for fast current edge rates has been discussed. The models have been constructed to amplify certain parts of the test vehicle during simulations.
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U2 - 10.1109/TADVP.2002.1017678
DO - 10.1109/TADVP.2002.1017678
M3 - Article
AN - SCOPUS:0036479019
SN - 1521-3323
VL - 25
SP - 4
EP - 11
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 1
ER -