Modeling and simulation of core switching noise on a package and board

Nanju Na, Madhavan Swaminathan, James Libous, Daniel O’Connor

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


This paper presents simulation and analysis of core switching noise on a CMOS test vehicle. The test vehicle consists of a ceramic ball grid array (CBGA) package on a printed circuit board (PCB). The entire test vehicle has been modeled by accounting for all the plane resonances using the cavity resonator method. The models included both the on-chip and off-chip decoupling capacitors. Using both time domain and frequency domain simulations, the role of plane resonances on power supply noise for fast current edge rates has been discussed. The models have been constructed to amplify certain parts of the test vehicle during simulations.

Original languageEnglish (US)
Pages (from-to)1095-1101
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2001

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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