Modeling and Simulation of Fiber Image Guide Multi-Chip Modules for MOEMS Applications

Steven P. Levitan, Timothy P. Kurzweg, Jose A. Martinez, Mark Kahrs, Jason Bakos, Craig Windish, Jason Boles, John Hansson, Michael Wiesser, Charles Kuznia, Donald M. Chiarulli

Research output: Contribution to journalConference articlepeer-review


Densely integrated systems in the future will incorporate device and communication technologies that span the domains of digital and analog electronics, optics, micro-mechanics, and micro-fluidics. Given the fundamental differences in substrate materials, feature scale and processing requirements between integrated devices in these domains, it is likely that multi-chip, system-in-package, integration solutions will be required for the foreseeable future. The multi-domain nature of these systems necessitates design tools that span multiple energy domains, time and length scales, as well as abstraction levels. This paper describes a case study of the modeling of a photonic/multi-technology system based on a 3D volumetric packaging technology implemented with Fiber Image Guide (FIG) based technology. It is 64×64 fiber crossbar switch implementation using three Silicon-on-Sapphire mixed signal switch die with flip-chip bonded VCSEL and detector arrays. We show a single end-to-end system simulation of the O/E crossbar working across the domains of free-space and guided wave optical propagation, GaAs O/E and E/O devices, analog drivers and receivers and integrated digital control.

Original languageEnglish (US)
Pages (from-to)141-150
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - 2004
EventMOEMS and Miniaturized Systems IV - San Jose, CA., United States
Duration: Jan 27 2004Jan 28 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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