Abstract
This paper presents a modeling and simulation approach for ground/power planes in high speed packages. Electrical characteristics of a plane structure is derived in terms of impedance (Z) or scattering (S) matrix at port locations in the frequency domain by solving Maxwell's equations. Since the solution is a closed form equation, the frequency and transient response can be computed efficiently requiring small computing time. The response of the plane structure has been captured using rational functions. These functions which are SPICE-compatible enable the connection of plane models to the rest of the package for simulation. The frequency and transient response computed using the analytical expression and rational functions have been compared against measurements. The simulation results show good correlation with measured data.
| Original language | English (US) |
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| Pages | 149-152 |
| Number of pages | 4 |
| State | Published - 1999 |
| Event | Proceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA Duration: Oct 25 1999 → Oct 27 1999 |
Conference
| Conference | Proceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | San Diego, CA, USA |
| Period | 10/25/99 → 10/27/99 |
All Science Journal Classification (ASJC) codes
- General Engineering