Skip to main navigation
Skip to search
Skip to main content
Penn State Home
Help & FAQ
Link opens in a new tab
Search content at Penn State
Home
Researchers
Research output
Research units
Equipment
Grants & Projects
Prizes
Activities
Modeling methods for power/ground plane structures in electronic packages
Jae Young Choi
,
Madhavan Swaminathan
Electrical Engineering
Research output
:
Chapter in Book/Report/Conference proceeding
›
Conference contribution
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Modeling methods for power/ground plane structures in electronic packages'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Modeling Method
100%
Electronic Packaging
100%
Power Plane
100%
Plane Structures
100%
Triangular Element
66%
Element Method
66%
Electromagnetic Energy
33%
Finite Element Method
33%
Finite Difference Method
33%
Multiple Layers
33%
Computational Efficiency
33%
Simulation Time
33%
Via Hole
33%
Ground Structure
33%
Small Features
33%
Large Memory
33%
Small Gap
33%
High Performance Work Systems
33%
Vertical Coupling
33%
High-speed Electronics
33%
Signal Routing
33%
Electronic Board
33%
Power Ground
33%
Accurate Results
33%
Memory Usage
33%
Power Delivery Network
33%
Engineering
Element Method
100%
Ground Plane
100%
Simulation Time
50%
Computational Efficiency
50%
Smallest Feature
50%
Finite Element Analysis
50%
Finite Difference Method
50%
Material Science
Finite Element Method
100%
Finite Difference Method
100%