TY - JOUR
T1 - Modeling of field penetration through planes in multilayered packages
AU - Mao, Jifeng
AU - Srinivasan, Jegannathan
AU - Choi, Jinseong
AU - Swaminathan, Madhavan
AU - Do, Nhon
N1 - Funding Information:
Manuscript received October 25, 2000; revised April 26, 2001. This paper was presented at the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Phoenix, AZ, October 23–25, 2000. This work was supported by the Semiconductor Research Corporation under Contract 735 001 J. Mao, J. Srinivasan, J. Choi, and M. Swaminathan are with the Department of Electrical and Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0250 USA (e-mail: [email protected]).
PY - 2001/8
Y1 - 2001/8
N2 - This paper describes a method for analyzing the field penetrating through planes in package power distribution networks. This field can cause excessive noise in the system at resonant frequencies of the package. The effect has been quantified both in the time and frequency domain and compared with measurements. General guidelines have been suggested to suppress this noise by varying the material and physical parameters of the planes.
AB - This paper describes a method for analyzing the field penetrating through planes in package power distribution networks. This field can cause excessive noise in the system at resonant frequencies of the package. The effect has been quantified both in the time and frequency domain and compared with measurements. General guidelines have been suggested to suppress this noise by varying the material and physical parameters of the planes.
UR - http://www.scopus.com/inward/record.url?scp=0035422035&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0035422035&partnerID=8YFLogxK
U2 - 10.1109/6040.938300
DO - 10.1109/6040.938300
M3 - Article
AN - SCOPUS:0035422035
SN - 1521-3323
VL - 24
SP - 326
EP - 333
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 3
ER -