Modeling of multi-layered power distribution planes including via effects using transmission matrix method

Joong Ho Kim; E. Matoglu; Jinwoo Choi; M. Swaminathan

doi:10.1109/ASPDAC.2002.994886

Modeling of multi-layered power distribution planes including via effects using transmission matrix method

Joong Ho Kim, E. Matoglu, Jinwoo Choi, M. Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Scopus citations

Abstract

This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice.

Original language	English (US)
Title of host publication	Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	59-64
Number of pages	6
ISBN (Electronic)	0769514413, 9780769514413
DOIs	https://doi.org/10.1109/ASPDAC.2002.994886
State	Published - 2002
Event	7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002 - Bangalore, India Duration: Jan 7 2002 → Jan 11 2002

Publication series

Name	Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002

Other

Other	7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
Country/Territory	India
City	Bangalore
Period	1/7/02 → 1/11/02

All Science Journal Classification (ASJC) codes

Computer Graphics and Computer-Aided Design
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ASPDAC.2002.994886

Cite this

Kim, J. H., Matoglu, E., Choi, J., & Swaminathan, M. (2002). Modeling of multi-layered power distribution planes including via effects using transmission matrix method. In Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002 (pp. 59-64). Article 994886 (Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2002.994886

Kim, Joong Ho ; Matoglu, E. ; Choi, Jinwoo et al. / Modeling of multi-layered power distribution planes including via effects using transmission matrix method. Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 59-64 (Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002).

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title = "Modeling of multi-layered power distribution planes including via effects using transmission matrix method",

abstract = "This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice.",

author = "Kim, {Joong Ho} and E. Matoglu and Jinwoo Choi and M. Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002 ; Conference date: 07-01-2002 Through 11-01-2002",

year = "2002",

doi = "10.1109/ASPDAC.2002.994886",

language = "English (US)",

series = "Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Kim, JH, Matoglu, E, Choi, J & Swaminathan, M 2002, Modeling of multi-layered power distribution planes including via effects using transmission matrix method. in Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002., 994886, Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002, Institute of Electrical and Electronics Engineers Inc., pp. 59-64, 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002, Bangalore, India, 1/7/02. https://doi.org/10.1109/ASPDAC.2002.994886

Modeling of multi-layered power distribution planes including via effects using transmission matrix method. / Kim, Joong Ho; Matoglu, E.; Choi, Jinwoo et al.
Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 59-64 994886 (Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice.

AB - This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice.

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BT - Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002

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Kim JH, Matoglu E, Choi J, Swaminathan M. Modeling of multi-layered power distribution planes including via effects using transmission matrix method. In Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 59-64. 994886. (Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002). doi: 10.1109/ASPDAC.2002.994886

Modeling of multi-layered power distribution planes including via effects using transmission matrix method

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