Modeling of multi-layered power distribution planes including via effects using transmission matrix method

Joong Ho Kim, E. Matoglu, Jinwoo Choi, M. Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice.

Original languageEnglish (US)
Title of host publicationProceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages59-64
Number of pages6
ISBN (Electronic)0769514413, 9780769514413
DOIs
StatePublished - 2002
Event7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002 - Bangalore, India
Duration: Jan 7 2002Jan 11 2002

Publication series

NameProceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002

Other

Other7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
Country/TerritoryIndia
CityBangalore
Period1/7/021/11/02

All Science Journal Classification (ASJC) codes

  • Computer Graphics and Computer-Aided Design
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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