TY - GEN
T1 - Modeling of multilayered packages and boards using modal decomposition and finite difference methods
AU - Engin, A. Ege
AU - Bharath, Krishna
AU - Srinivasan, Krishna
AU - Swaminathan, Madhavan
PY - 2006
Y1 - 2006
N2 - Simultaneous switching noise (SSN) is a major signal integrity (SI) and electromagnetic interference (EMI) problem. SSN involves the interaction between the power/ground planes and the transmission lines. Through the power/ground planes, there can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. In addition, transmission lines can excite the planes at return path discontinuities. Due to the large size of systems packaging, it is difficult to analyze such problems using full-wave simulators. We present an accurate and efficient modeling approach based on the finite difference method (FDM). Power/ground planes are modeled using FDM, while the transmission lines are incorporated using a modal decomposition method.
AB - Simultaneous switching noise (SSN) is a major signal integrity (SI) and electromagnetic interference (EMI) problem. SSN involves the interaction between the power/ground planes and the transmission lines. Through the power/ground planes, there can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. In addition, transmission lines can excite the planes at return path discontinuities. Due to the large size of systems packaging, it is difficult to analyze such problems using full-wave simulators. We present an accurate and efficient modeling approach based on the finite difference method (FDM). Power/ground planes are modeled using FDM, while the transmission lines are incorporated using a modal decomposition method.
UR - http://www.scopus.com/inward/record.url?scp=34047209903&partnerID=8YFLogxK
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U2 - 10.1109/isemc.2006.1706390
DO - 10.1109/isemc.2006.1706390
M3 - Conference contribution
AN - SCOPUS:34047209903
SN - 142440293X
SN - 9781424402939
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 646
EP - 650
BT - 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
Y2 - 14 August 2006 through 18 August 2006
ER -