Abstract
This paper describes the analysis of multilayeredpower distribution networks that include signal lines and vias. The signal lines are modeled as transmission lines, and vias are represented as not only self and mutual inductances but also include retardation currents. The structures have been analysed using the Transmission Matrix Method (TMM) in the frequency domain. Analysis using the TMM provides considerable savings in memory compared to Spice.
| Original language | English (US) |
|---|---|
| Pages | 233-236 |
| Number of pages | 4 |
| State | Published - 2004 |
| Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Conference
| Conference | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Portland, OR |
| Period | 10/25/04 → 10/27/04 |
All Science Journal Classification (ASJC) codes
- Engineering(all)