TY - JOUR
T1 - Modeling of simultaneous switching noise in high speed systems
AU - Chun, Sungjun
AU - Swaminathan, Madhavan
AU - Smith, Larry D.
AU - Srinivasan, Jegannathan
AU - Jin, Zhang
AU - Iyer, Mahadevan K.
PY - 2001/5
Y1 - 2001/5
N2 - Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems.
AB - Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems.
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U2 - 10.1109/6040.928747
DO - 10.1109/6040.928747
M3 - Article
AN - SCOPUS:0035329204
SN - 1521-3323
VL - 24
SP - 132
EP - 142
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 2
ER -