Modeling of simultaneous switching noise in high speed systems

Sungjun Chun, Madhavan Swaminathan, Larry D. Smith, Jegannathan Srinivasan, Zhang Jin, Mahadevan K. Iyer

Research output: Contribution to journalArticlepeer-review

108 Scopus citations

Abstract

Simultaneous switching noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition theory. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a test vehicle, verifying the validity of the method. In addition a system has been simulated to compute SSN, showing the application of this method for complex systems.

Original languageEnglish (US)
Pages (from-to)132-142
Number of pages11
JournalIEEE Transactions on Advanced Packaging
Volume24
Issue number2
DOIs
StatePublished - May 2001

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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