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Modeling the atomic transport kinetics in high-lead solders
G. Ghosh,
Z. K. Liu
Materials Science and Engineering
Institute for Computational and Data Sciences (ICDS)
Materials Research Institute (MRI)
Research output
:
Contribution to journal
›
Article
›
peer-review
14
Scopus citations
Overview
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Chemical Compounds
Solder
100%
Compound Mobility
61%
Alloy
56%
Liquid
43%
Face-Centered Cubic Crystal System
43%
Kinetics Type
37%
Dissolution
30%
Simulation
25%
Diffusion
24%
Physics & Astronomy
solders
90%
tracers
52%
diffusivity
49%
kinetics
48%
atomic mobilities
39%
dissolving
24%
liquid phases
22%
temperature dependence
17%
profiles
14%
liquids
14%
simulation
10%
temperature
7%
Engineering & Materials Science
Soldering alloys
79%
Lead
74%
Tracers
62%
Liquids
36%
Chemical analysis
35%
Dissolution
28%
Temperature
21%
Uncertainty
16%