TY - GEN
T1 - Modeling the effects of the PCB motion on the response of microstructures under mechanical shock
AU - Ramini, Abdallah H.
AU - Younis, Mohammad I.
AU - Miles, Ronald
PY - 2010
Y1 - 2010
N2 - Microelectomechanical systems (MEMS) are often used in portable electronic products that can be subjected to mechanical shock or impact due to being dropped accidentally. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics ofMEMS microstructures when subjected to shock. Two models are presented. In the first approach, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second approach, a special case of a cantilever microbeam is modeled as a distributedparameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are solved numerically by integration of the equation of motion over time using the Galerkin procedure. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the MEMS device. It is observed from the results that in some cases, depending on the different parameters of the problem, the response of the microstructure can be amplified causing early dynamic pull-in and hence possibly failure ofthe device.
AB - Microelectomechanical systems (MEMS) are often used in portable electronic products that can be subjected to mechanical shock or impact due to being dropped accidentally. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics ofMEMS microstructures when subjected to shock. Two models are presented. In the first approach, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second approach, a special case of a cantilever microbeam is modeled as a distributedparameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are solved numerically by integration of the equation of motion over time using the Galerkin procedure. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the MEMS device. It is observed from the results that in some cases, depending on the different parameters of the problem, the response of the microstructure can be amplified causing early dynamic pull-in and hence possibly failure ofthe device.
UR - https://www.scopus.com/pages/publications/77953701346
UR - https://www.scopus.com/inward/citedby.url?scp=77953701346&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2010.5464602
DO - 10.1109/ESIME.2010.5464602
M3 - Conference contribution
AN - SCOPUS:77953701346
SN - 9781424470266
T3 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
T2 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Y2 - 26 April 2010 through 28 April 2010
ER -