Module placement for power supply noise and wire congestion avoidance in 3D packaging

Jacob Minz; Sung Kyu Lim; Jinwoo Choi; Madhavan Swaminathan

Module placement for power supply noise and wire congestion avoidance in 3D packaging

Jacob Minz, Sung Kyu Lim, Jinwoo Choi, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

3 Scopus citations

Abstract

In this work, we present an automatic module placement algorithm for simultaneous power supply noise and routing congestion minimization for 3D packaging. We employ decoupling capacitance insertion for noise suppression and 3D global routing for congestion avoidance.

Original language	English (US)
Pages	123-126
Number of pages	4
State	Published - 2004
Event	IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004

Conference

Conference	IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
Country/Territory	United States
City	Portland, OR
Period	10/25/04 → 10/27/04

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

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title = "Module placement for power supply noise and wire congestion avoidance in 3D packaging",

abstract = "In this work, we present an automatic module placement algorithm for simultaneous power supply noise and routing congestion minimization for 3D packaging. We employ decoupling capacitance insertion for noise suppression and 3D global routing for congestion avoidance.",

author = "Jacob Minz and Lim, {Sung Kyu} and Jinwoo Choi and Madhavan Swaminathan",

year = "2004",

language = "English (US)",

pages = "123--126",

note = "IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 25-10-2004 Through 27-10-2004",

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TY - CONF

T1 - Module placement for power supply noise and wire congestion avoidance in 3D packaging

AU - Minz, Jacob

AU - Lim, Sung Kyu

AU - Choi, Jinwoo

AU - Swaminathan, Madhavan

PY - 2004

Y1 - 2004

N2 - In this work, we present an automatic module placement algorithm for simultaneous power supply noise and routing congestion minimization for 3D packaging. We employ decoupling capacitance insertion for noise suppression and 3D global routing for congestion avoidance.

AB - In this work, we present an automatic module placement algorithm for simultaneous power supply noise and routing congestion minimization for 3D packaging. We employ decoupling capacitance insertion for noise suppression and 3D global routing for congestion avoidance.

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UR - http://www.scopus.com/inward/citedby.url?scp=15944372883&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:15944372883

SP - 123

EP - 126

T2 - IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 25 October 2004 through 27 October 2004

ER -

Module placement for power supply noise and wire congestion avoidance in 3D packaging

Abstract

Conference

All Science Journal Classification (ASJC) codes

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