Multi-layer fringe-field augmentations for the efficient modeling of package power planes

Krishna Bharath; Nithya Sankaran; A. Ege Engin; Madhavan Swaminathan

doi:10.1109/EPEP.2008.4675948

Multi-layer fringe-field augmentations for the efficient modeling of package power planes

Krishna Bharath, Nithya Sankaran, A. Ege Engin, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.

Original language	English (US)
Title of host publication	Electrical Performance of Electronic Packaging, EPEP 2008
Pages	331-334
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2008.4675948
State	Published - 2008
Event	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States Duration: Oct 27 2008 → Oct 29 2008

Publication series

Name	Electrical Performance of Electronic Packaging, EPEP

Conference

Conference	17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Country/Territory	United States
City	San Jose, CA
Period	10/27/08 → 10/29/08

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/EPEP.2008.4675948

Cite this

@inproceedings{f8f836143e4c45b38c6c3603164b74ca,

title = "Multi-layer fringe-field augmentations for the efficient modeling of package power planes",

abstract = "Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.",

author = "Krishna Bharath and Nithya Sankaran and Engin, {A. Ege} and Madhavan Swaminathan",

year = "2008",

doi = "10.1109/EPEP.2008.4675948",

language = "English (US)",

isbn = "9781424428731",

series = "Electrical Performance of Electronic Packaging, EPEP",

pages = "331--334",

booktitle = "Electrical Performance of Electronic Packaging, EPEP 2008",

note = "17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 ; Conference date: 27-10-2008 Through 29-10-2008",

}

Bharath, K, Sankaran, N, Engin, AE & Swaminathan, M 2008, Multi-layer fringe-field augmentations for the efficient modeling of package power planes. in Electrical Performance of Electronic Packaging, EPEP 2008., 4675948, Electrical Performance of Electronic Packaging, EPEP, pp. 331-334, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, San Jose, CA, United States, 10/27/08. https://doi.org/10.1109/EPEP.2008.4675948

Multi-layer fringe-field augmentations for the efficient modeling of package power planes. / Bharath, Krishna; Sankaran, Nithya; Engin, A. Ege et al.
Electrical Performance of Electronic Packaging, EPEP 2008. 2008. p. 331-334 4675948 (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Multi-layer fringe-field augmentations for the efficient modeling of package power planes

AU - Bharath, Krishna

AU - Sankaran, Nithya

AU - Engin, A. Ege

AU - Swaminathan, Madhavan

PY - 2008

Y1 - 2008

N2 - Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.

AB - Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.

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BT - Electrical Performance of Electronic Packaging, EPEP 2008

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Y2 - 27 October 2008 through 29 October 2008

ER -

Multi-layer fringe-field augmentations for the efficient modeling of package power planes

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All Science Journal Classification (ASJC) codes

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