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Multi-layer photopolymer micromachining
J. R. Huang
, B. Bai
, J. Shaw
,
T. N. Jackson
, C. Y. Wei
, V. Manivannan
, K. Durocher
Materials Research Institute (MRI)
Electrical Engineering
Research output
:
Contribution to journal
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Conference article
›
peer-review
1
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Scopus citations
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Keyphrases
Microstructure
100%
Micromachining
100%
Photopolymer
100%
High Aspect Ratio
50%
Micro-electro-mechanical Systems
50%
Dry Film
50%
Storage Capacity
25%
Three-dimensional (3D)
25%
Integrated Circuits
25%
Electronic Devices
25%
Microfluidic Channel
25%
Photolithography
25%
Two-layer
25%
Multiple Layers
25%
Aspect Ratio
25%
Polymer Film
25%
Lamination
25%
Solution Process
25%
Glass Substrate
25%
Array of Channels
25%
Height-to-width Ratio
25%
SU-8
25%
Viscous Solution
25%
Picoliter
25%
Vacuum Infiltration
25%
Microdevice
25%
Additive Process
25%
Process Complexity
25%
Infiltration Process
25%
Speed Process
25%
Fluid Manipulation
25%
High-aspect-ratio Microstructures
25%
Doctor Blade Coating
25%
Biodevices
25%
2D Array
25%
Bar Coating
25%
Solution Layer
25%
Integrated Detector
25%
Deep Trench
25%
3D Microstructure
25%
Miniaturized Structures
25%
Microtrench
25%
Microstructure Fabrication
25%
Film Cycles
25%
Photoimageable
25%
Reduced Process
25%
Engineering
Micro Machining
100%
Photopolymer
100%
High Aspect Ratio
66%
Micro-Electro-Mechanical System
66%
Thin Films
33%
Storage Capacity
33%
Optical Lithography
33%
Integrated Optoelectronics
33%
Microfluidic Channel
33%
Integrated Information System
33%
Solution Process
33%
Layer Solution
33%
Doctor Blade Coating
33%
Integrated Circuit
33%
Aspect Ratio
33%
Glass Substrate
33%
Additive Process
33%
Biodevices
33%
Polymer
33%
Material Science
Film
100%
Multilayer
100%
Micromachining
100%
Microelectromechanical System
50%
Electronic Circuit
25%
Thin Films
25%
Polymer Films
25%
Glass Substrate
25%