TY - GEN
T1 - Multi-output MLP Architecture for Machining Process Parameter Classification
AU - Fisher, Dylan
AU - Liaw, Jonathan
AU - Loker, David
N1 - Publisher Copyright:
© The Author(s), under exclusive license to Springer Nature Switzerland AG 2026.
PY - 2026
Y1 - 2026
N2 - Remote monitoring of manufacturing processes plays a crucial role in enhancing productivity, reducing production costs, and improving product quality in machining related industries. Traditional remote monitoring methods rely on invasive sensor installation, which can be costly to install and may interfere with production. This paper uses an efficient, non-invasive method of using microphones and machine learning to classify key machining parameters: spindle speed (RPM), depth of cut (DOC), and feed rate (FR). Conventional machine learning approaches typically classify one parameter at a time, while the alternative deep learning approaches tend to be more computationally expensive, featuring a high number of parameters. In this paper, we explore a simpler neural network model – a multi-layer perceptron (MLP) with a branched architecture capable of simultaneous multi-parameter classification. A dataset of audio recordings from a microphone array on machining operations was first collected. Recorded test data was then autocorrelated, processed through a Fast Fourier Transform (FFT), and then normalized to decrease noise. Optimal model hyperparameters were determined through Bayesian hyperparameter tuning. The developed multi-output model achieved a classification accuracy of 93% (FR), 99% (DOC), and 100% (RPM). The multi-output model featured fewer parameters (1.85 M) compared to that of deeper architectures such as VGG16 (135 M parameters), which was used for the same task in other studies, highlighting the effectiveness of the MLP architecture.
AB - Remote monitoring of manufacturing processes plays a crucial role in enhancing productivity, reducing production costs, and improving product quality in machining related industries. Traditional remote monitoring methods rely on invasive sensor installation, which can be costly to install and may interfere with production. This paper uses an efficient, non-invasive method of using microphones and machine learning to classify key machining parameters: spindle speed (RPM), depth of cut (DOC), and feed rate (FR). Conventional machine learning approaches typically classify one parameter at a time, while the alternative deep learning approaches tend to be more computationally expensive, featuring a high number of parameters. In this paper, we explore a simpler neural network model – a multi-layer perceptron (MLP) with a branched architecture capable of simultaneous multi-parameter classification. A dataset of audio recordings from a microphone array on machining operations was first collected. Recorded test data was then autocorrelated, processed through a Fast Fourier Transform (FFT), and then normalized to decrease noise. Optimal model hyperparameters were determined through Bayesian hyperparameter tuning. The developed multi-output model achieved a classification accuracy of 93% (FR), 99% (DOC), and 100% (RPM). The multi-output model featured fewer parameters (1.85 M) compared to that of deeper architectures such as VGG16 (135 M parameters), which was used for the same task in other studies, highlighting the effectiveness of the MLP architecture.
UR - https://www.scopus.com/pages/publications/105027204104
UR - https://www.scopus.com/pages/publications/105027204104#tab=citedBy
U2 - 10.1007/978-3-032-08977-9_23
DO - 10.1007/978-3-032-08977-9_23
M3 - Conference contribution
AN - SCOPUS:105027204104
SN - 9783032089762
T3 - Communications in Computer and Information Science
SP - 371
EP - 384
BT - SEET - Software Engineering for Emerging Technologies - 1st International Conference, SEET 2025, Proceedings
A2 - Hussain, Shahid
A2 - Khan, Arif Ali
A2 - Abdul Basit Ur Rahim, Muhammad
A2 - Khan, Saif Ur Rehman
PB - Springer Science and Business Media Deutschland GmbH
T2 - 1st International Conference on Software Engineering of Emerging Technologies, SEET 2025
Y2 - 11 August 2025 through 12 August 2025
ER -