Multi-Physics Modeling and Characterization of Components on Flexible Substrates

Sridhar Sivapurapu, Rui Chen, Chirag Mehta, Yi Zhou, Mohamed L.F. Bellaredj, Xiaotong Jia, Paul A. Kohl, Tsung Ching Huang, Suresh K. Sitaraman, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

19 Scopus citations


Due to the increased popularity of wearable devices, designing flexible hybrid electronics (FHE) is becoming increasingly critical. Some emerging systems that require FHE include wearables, energy-harvesting devices, sensory networks, and electrocardiogram monitors. These systems require designers to account for different flexible actions, such as stretching, bending, twisting, etc. Accounting for different flexible actions requires models for different components that capture the behavior under these actions. This work focuses on characterizing the effects of bending two components, namely, printed microstrip transmission lines and power inductors. In this work, both the mechanical and electrical aspects are captured specifically for aerosol jet-printed (AJP) transmission lines, screen-printed (SP) transmission lines, and SP power inductors on flexible substrates using 3-D finite element modeling (FEM), which are then correlated with the measurements. The challenges in such multi-physics modeling and measurements are discussed, including the effect of bending.

Original languageEnglish (US)
Article number8777174
Pages (from-to)1730-1740
Number of pages11
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number9
StatePublished - Sep 2019

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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