@inproceedings{945e2c4f158c458396c6c03958840e01,
title = "Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)",
abstract = "We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.",
author = "Daniel Kuchta and Jonathan Proesel and Fuad Doany and Wooram Lee and Timothy Dickson and Herschel Ainspan and Mounir Meghelli and Petar Pepeljugoski and Xiaoxiong Gu and Michael Beakes and Mark Schultz and Marc Taubenblatt and Paul Fortier and Catherine Dufort and Eric Turcotte and Pion, \{Marc Olivier\} and Charles Bureau and Frank Flens and Greta Light and Blake Trekell and Kevin Koski",
note = "Funding Information: The information, data, or work presented herein was funded in part by the Advanced Research Projects Agency-Energy (ARPA-E), U.S. Department of Energy, under Award Number DE-AR0000846. The views and opinions of authors expressed herein do not necessarily state or reflect those of the U.S. Government or any agency thereof. Publisher Copyright: {\textcopyright} 2019 OSA.; 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 ; Conference date: 03-03-2019 Through 07-03-2019",
year = "2019",
month = apr,
day = "22",
doi = "10.1364/ofc.2019.m4d.6",
language = "English (US)",
series = "2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings",
address = "United States",
}