Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes

A. Ege Engin, Krishna Bharath, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

80 Scopus citations

Abstract

Power/ground planes in electronic packaging can be a major factor for noise coupling. There can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. Due to the large size of the power/ground planes, it is difficult to analyze them using full-wave simulators. It is known that the finite-difference solution of the Helmholtz equation provides a faster approach with comparable accuracy. For multilayered planes and arbitrary geometries with aperture coupling, we present a multilayered finite-difference method (MFDM). It provides an accurate representation of wrap-around currents, which have not been modeled earlier, for large cutouts. Estimation of the influence of such coupling effects are essential especially for a successful design of mixed-signal systems. This method allows to consider realistic structures, which would be prohibitive to simulate using full-wave simulators.

Original languageEnglish (US)
Pages (from-to)441-447
Number of pages7
JournalIEEE Transactions on Electromagnetic Compatibility
Volume49
Issue number2
DOIs
StatePublished - May 2007

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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