Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi; Dong Gun Kam; Daehyun Chung; Krishna Srinivasan; Vinu Govind; Joungho Kim; Madhavan Swaminathan

doi:10.1109/TADVP.2007.896921

Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Krishna Srinivasan, Vinu Govind, Joungho Kim, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.

Original language	English (US)
Pages (from-to)	180-190
Number of pages	11
Journal	IEEE Transactions on Advanced Packaging
Volume	30
Issue number	2
DOIs	https://doi.org/10.1109/TADVP.2007.896921
State	Published - May 2007

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/TADVP.2007.896921

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title = "Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications",

abstract = "This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.",

author = "Jinwoo Choi and Kam, {Dong Gun} and Daehyun Chung and Krishna Srinivasan and Vinu Govind and Joungho Kim and Madhavan Swaminathan",

note = "Funding Information: Manuscript received May 14, 2006; revised February 23, 2007. This work was supported in part by Semiconductor Research Corporation (SRC) under Georgia Tech ID E21-6MW, in part by the National Science Foundation under Georgia Tech ID E21-N33, and in part by Yamacraw, a state funded initiative in the State of Georgia.",

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doi = "10.1109/TADVP.2007.896921",

language = "English (US)",

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AU - Choi, Jinwoo

AU - Kam, Dong Gun

AU - Chung, Daehyun

AU - Srinivasan, Krishna

AU - Govind, Vinu

AU - Kim, Joungho

AU - Swaminathan, Madhavan

N1 - Funding Information: Manuscript received May 14, 2006; revised February 23, 2007. This work was supported in part by Semiconductor Research Corporation (SRC) under Georgia Tech ID E21-6MW, in part by the National Science Foundation under Georgia Tech ID E21-N33, and in part by Yamacraw, a state funded initiative in the State of Georgia.

PY - 2007/5

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N2 - This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.

AB - This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.

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Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Abstract

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