Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Krishna Srinivasan, Vinu Govind, Joungho Kim, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.

Original languageEnglish (US)
Pages (from-to)180-190
Number of pages11
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number2
DOIs
StatePublished - May 2007

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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