Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi; Dong Gun Kam; Daehyun Chung; Krishna Srinivasan; Vinu Govind; Joungho Kim; Madhavan Swaminathan

doi:10.1109/EPEP.2005.1563703

Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Krishna Srinivasan, Vinu Govind, Joungho Kim, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

This paper presents near field (NF) and far field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in package and board. Three test vehicles have been designed and fabricated for near field and far field measurements. Simulation results using a full wave solver (SONNET™) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure for noise reduction in mixed-signal systems.

Original language	English (US)
Title of host publication	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages	69-72
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2005.1563703
State	Published - 2005
Event	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States Duration: Oct 24 2005 → Oct 26 2005

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume	2005

Conference

Conference	14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/Territory	United States
City	Austin, TX
Period	10/24/05 → 10/26/05

All Science Journal Classification (ASJC) codes

General Engineering

Access to Document

10.1109/EPEP.2005.1563703

Cite this

Choi, J., Kam, D. G., Chung, D., Srinivasan, K., Govind, V., Kim, J., & Swaminathan, M. (2005). Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 (pp. 69-72). Article 1563703 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005). https://doi.org/10.1109/EPEP.2005.1563703

@inproceedings{9062bad85dc148a59e2549edee4283b9,

title = "Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications",

abstract = "This paper presents near field (NF) and far field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in package and board. Three test vehicles have been designed and fabricated for near field and far field measurements. Simulation results using a full wave solver (SONNET{\texttrademark}) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure for noise reduction in mixed-signal systems.",

author = "Jinwoo Choi and Kam, {Dong Gun} and Daehyun Chung and Krishna Srinivasan and Vinu Govind and Joungho Kim and Madhavan Swaminathan",

year = "2005",

doi = "10.1109/EPEP.2005.1563703",

language = "English (US)",

isbn = "0780392205",

series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

pages = "69--72",

booktitle = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005",

note = "14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 ; Conference date: 24-10-2005 Through 26-10-2005",

}

Choi, J, Kam, DG, Chung, D, Srinivasan, K, Govind, V, Kim, J & Swaminathan, M 2005, Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications. in 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005., 1563703, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, vol. 2005, pp. 69-72, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, Austin, TX, United States, 10/24/05. https://doi.org/10.1109/EPEP.2005.1563703

Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications. / Choi, Jinwoo; Kam, Dong Gun; Chung, Daehyun et al.
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 69-72 1563703 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

AU - Choi, Jinwoo

AU - Kam, Dong Gun

AU - Chung, Daehyun

AU - Srinivasan, Krishna

AU - Govind, Vinu

AU - Kim, Joungho

AU - Swaminathan, Madhavan

PY - 2005

Y1 - 2005

N2 - This paper presents near field (NF) and far field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in package and board. Three test vehicles have been designed and fabricated for near field and far field measurements. Simulation results using a full wave solver (SONNET™) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure for noise reduction in mixed-signal systems.

AB - This paper presents near field (NF) and far field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in package and board. Three test vehicles have been designed and fabricated for near field and far field measurements. Simulation results using a full wave solver (SONNET™) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure for noise reduction in mixed-signal systems.

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M3 - Conference contribution

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SN - 0780392205

SN - 9780780392205

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

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BT - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

T2 - 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005

Y2 - 24 October 2005 through 26 October 2005

ER -

Choi J, Kam DG, Chung D, Srinivasan K, Govind V, Kim J et al. Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. 2005. p. 69-72. 1563703. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging). doi: 10.1109/EPEP.2005.1563703

Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

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All Science Journal Classification (ASJC) codes

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