TY - JOUR
T1 - New Opportunities in Metallization Integration in Cofired Electroceramic Multilayers by the Cold Sintering Process
AU - De Beauvoir, Thomas Hérisson
AU - Dursun, Sinan
AU - Gao, Lisheng
AU - Randall, Clive
N1 - Publisher Copyright:
Copyright © 2019 American Chemical Society.
PY - 2019/7/23
Y1 - 2019/7/23
N2 - Metallization with high conductivities is critical in the design of high performance multilayer electroceramic devices. Cold sintering offers exciting new opportunities in the integration of different material classes; here we explore novel metal chemistries and demonstrate their integration into ceramic multilayers. The processing is enabled due to the cosintering of both the ceramic and metal powders in fast times and at extremely low sintering temperatures. Metal powders are printed as pastes and formed into multilayers that can be cosintered with the ceramic ZnO; these specific metals include Cu, Fe, and Al. The multilayer structures are assembled and fabricated under a thick film process and enabled by using a polypropylene carbonate binder system that can be removed at low temperatures under N2-H2 forming gas, permitting control of oxidation of the Cu, Fe, and Al. As a result, extremely high conductivity electrodes are fabricated and quantified through the equivalent series resistance (ESR). In addition, new electrode composite concepts, such as mixed particles of Fe-Cu cosintered in between the ZnO layers, are possible with the cold sintering process.
AB - Metallization with high conductivities is critical in the design of high performance multilayer electroceramic devices. Cold sintering offers exciting new opportunities in the integration of different material classes; here we explore novel metal chemistries and demonstrate their integration into ceramic multilayers. The processing is enabled due to the cosintering of both the ceramic and metal powders in fast times and at extremely low sintering temperatures. Metal powders are printed as pastes and formed into multilayers that can be cosintered with the ceramic ZnO; these specific metals include Cu, Fe, and Al. The multilayer structures are assembled and fabricated under a thick film process and enabled by using a polypropylene carbonate binder system that can be removed at low temperatures under N2-H2 forming gas, permitting control of oxidation of the Cu, Fe, and Al. As a result, extremely high conductivity electrodes are fabricated and quantified through the equivalent series resistance (ESR). In addition, new electrode composite concepts, such as mixed particles of Fe-Cu cosintered in between the ZnO layers, are possible with the cold sintering process.
UR - https://www.scopus.com/pages/publications/85078173096
UR - https://www.scopus.com/inward/citedby.url?scp=85078173096&partnerID=8YFLogxK
U2 - 10.1021/acsaelm.9b00184
DO - 10.1021/acsaelm.9b00184
M3 - Article
AN - SCOPUS:85078173096
SN - 2637-6113
VL - 1
SP - 1198
EP - 1207
JO - ACS Applied Electronic Materials
JF - ACS Applied Electronic Materials
IS - 7
ER -