New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os

David C. Zhang; Madhavan Swaminathan; Suzanne Huh

doi:10.1109/EPEPS.2012.6457849

New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os

David C. Zhang, Madhavan Swaminathan, Suzanne Huh

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.

Original language	English (US)
Title of host publication	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages	87-90
Number of pages	4
DOIs	https://doi.org/10.1109/EPEPS.2012.6457849
State	Published - 2012
Event	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States Duration: Oct 21 2012 → Oct 24 2012

Publication series

Name	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Conference

Conference	2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Country/Territory	United States
City	Tempe, AZ
Period	10/21/12 → 10/24/12

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/EPEPS.2012.6457849

Cite this

Zhang, D. C., Swaminathan, M., & Huh, S. (2012). New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 (pp. 87-90). Article 6457849 (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012). https://doi.org/10.1109/EPEPS.2012.6457849

Zhang, David C. ; Swaminathan, Madhavan ; Huh, Suzanne. / New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os. 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. pp. 87-90 (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012).

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title = "New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os",

abstract = "Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.",

author = "Zhang, {David C.} and Madhavan Swaminathan and Suzanne Huh",

year = "2012",

doi = "10.1109/EPEPS.2012.6457849",

language = "English (US)",

isbn = "9781467325394",

series = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",

pages = "87--90",

booktitle = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012",

note = "2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 ; Conference date: 21-10-2012 Through 24-10-2012",

}

Zhang, DC, Swaminathan, M & Huh, S 2012, New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os. in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012., 6457849, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, pp. 87-90, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, Tempe, AZ, United States, 10/21/12. https://doi.org/10.1109/EPEPS.2012.6457849

New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os. / Zhang, David C.; Swaminathan, Madhavan; Huh, Suzanne.
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 87-90 6457849 (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Zhang, David C.

AU - Swaminathan, Madhavan

AU - Huh, Suzanne

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N2 - Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.

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M3 - Conference contribution

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BT - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

T2 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Y2 - 21 October 2012 through 24 October 2012

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Zhang DC, Swaminathan M, Huh S. New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 87-90. 6457849. (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012). doi: 10.1109/EPEPS.2012.6457849

New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os

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All Science Journal Classification (ASJC) codes

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