Abstract
The application of corona charging technique in thermal Si/SiO 2 semiconductor devices and electron spin resonance (ESR) experiments was analyzed. Investigation shows that the corona charging techniques were inherently unreliable and invasive. It was found that high-field stressing via corona biasing was more rough as compared to the high-field stressing via gate biasing. The results show that low-field corona biasing was noninvasive and could be used for the reliability characterization of defect structures.
Original language | English (US) |
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Pages (from-to) | 1844-1845 |
Number of pages | 2 |
Journal | Applied Physics Letters |
Volume | 85 |
Issue number | 10 |
DOIs | |
State | Published - Sep 6 2004 |
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)