Novel Glass Material with Low Loss and Permittivity for 5G/6G Integrated Circuits

Rocio Rodriguez-Cano, Michael T. Lanagan, Nicholas L. Clark, John C. Mauro

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new borosilicate glass with lower loss and permittivity than any commercial glass has been proposed in this contribution as a substrate or interposer for mm-wave and THz integrated electronics. The glass is composed of a microstructure enclosing high-purity boron rich areas and silicon rich areas. This phase-separated areas are several orders of magnitude smaller than the wavelength at 1 THz.

Original languageEnglish (US)
Title of host publication2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), INC-USNC-URSI 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages261-262
Number of pages2
ISBN (Electronic)9789463968119
DOIs
StatePublished - 2024
Event2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), INC-USNC-URSI 2024 - Florence, Italy
Duration: Jul 14 2024Jul 19 2024

Publication series

Name2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), INC-USNC-URSI 2024 - Proceedings

Conference

Conference2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), INC-USNC-URSI 2024
Country/TerritoryItaly
CityFlorence
Period7/14/247/19/24

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computational Mathematics
  • Instrumentation

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