Novel low-cost approach to MCM interconnect test

This paper describes a novel and low-cost technique for detecting process-related interconnect faults in MCMs. This method is an alternative to existing test methods such as TDR, TDT, electron beam, and capacitance techniques which are either expensive in terms of test equipment, are cumbersome due to the requirement of multiple probes, or provide poor fault coverage. The proposed technique applies a stimulus through a tuned load and a single probe at one end of the interconnect. By measuring the attenuation of the test stimulus due to pole movement relative to known attenuation measurements, interconnect faults such as near-opens, near-shorts, opens, and shorts can be detected. The total test time is small and the hardware cost of test equipment is low. Extensive simulations have been performed to show the validity of the method.