Novel MCM interconnect test technique based on resonator principles and transmission line theory

Bruce C. Kim, Madhavan Swaminathan, Abhijit Chatterjee

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

This paper describes a new technique for detecting and diagnosing process-related interconnect faults in MCMs. The technique uses a single-ended probe with a resonator and a waveform generator. A complete fault diagnosis is possible through measurement of magnitude and phase responses.

Original languageEnglish (US)
Pages117-119
Number of pages3
StatePublished - 1995
EventProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA
Duration: Oct 2 1995Oct 4 1995

Conference

ConferenceProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging
CityPortland, OR, USA
Period10/2/9510/4/95

All Science Journal Classification (ASJC) codes

  • General Engineering

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