Abstract
This paper describes a new technique for detecting and diagnosing process-related interconnect faults in MCMs. The technique uses a single-ended probe with a resonator and a waveform generator. A complete fault diagnosis is possible through measurement of magnitude and phase responses.
| Original language | English (US) |
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| Pages | 117-119 |
| Number of pages | 3 |
| State | Published - 1995 |
| Event | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA Duration: Oct 2 1995 → Oct 4 1995 |
Conference
| Conference | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | Portland, OR, USA |
| Period | 10/2/95 → 10/4/95 |
All Science Journal Classification (ASJC) codes
- General Engineering