Oblique incidence feature mapping techniques for the NDE of adhesive bonds

The Oblique Incidence technique proposed here, utilizes shear waves, obliquely incident upon an interface, in a physically based feature analysis process. Guidelines for the data collection process are selected from numerically established reflection factor curves using a theoretical model of the interface between two solid materials with different rigidities of connection. The additional sensitivity of the shear waves can be anticipated from the existence of the tangential components of displacements which are more sensitive to interfacial weaknesses. Also the frequency and angle dependence of the reflectivity from an imperfect interface has led us to the possibility of using the relevant feature combinations as dictated by our model.