TY - GEN
T1 - On The Absolute Sensitivity of Near-Zero Field Magnetoresistance for Device Reliability Studies
AU - Allridge, Elijah A.
AU - Lenahan, Patrick M.
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - We report on the absolute sensitivity of a new semiconductor device reliability technique, near-zero field magnetoresistance. There has been fairly substantial effort in developing this tool for the analysis of defect structures, but the absolute sensitivity of the technique has yet to been explored. The primary goal of this study is to find an absolute sensitivity value, as well as to determine the spectrometer parameters for achieving this maximum sensitivity. Using the dc I-V biasing scheme on Si/SiO2 MOSFET arrays, we show that this technique is more sensitive and easier to perform than its sister technique, electrically detected magnetic resonance. We find that the absolute sensitivity is fewer than 1,000 defects, and we hypothesize that future efforts could allow for the technique to achieve sensitivity to fewer than 100 defects.
AB - We report on the absolute sensitivity of a new semiconductor device reliability technique, near-zero field magnetoresistance. There has been fairly substantial effort in developing this tool for the analysis of defect structures, but the absolute sensitivity of the technique has yet to been explored. The primary goal of this study is to find an absolute sensitivity value, as well as to determine the spectrometer parameters for achieving this maximum sensitivity. Using the dc I-V biasing scheme on Si/SiO2 MOSFET arrays, we show that this technique is more sensitive and easier to perform than its sister technique, electrically detected magnetic resonance. We find that the absolute sensitivity is fewer than 1,000 defects, and we hypothesize that future efforts could allow for the technique to achieve sensitivity to fewer than 100 defects.
UR - https://www.scopus.com/pages/publications/85190365809
UR - https://www.scopus.com/pages/publications/85190365809#tab=citedBy
U2 - 10.1109/IIRW59383.2023.10477708
DO - 10.1109/IIRW59383.2023.10477708
M3 - Conference contribution
AN - SCOPUS:85190365809
T3 - IEEE International Integrated Reliability Workshop Final Report
BT - 2023 IEEE International Integrated Reliability Workshop, IIRW 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE International Integrated Reliability Workshop, IIRW 2023
Y2 - 8 October 2023 through 12 October 2023
ER -