Skip to main navigation
Skip to search
Skip to main content
Penn State Home
Help & FAQ
Home
Researchers
Research output
Research units
Equipment
Grants & Projects
Prizes
Activities
Search by expertise, name or affiliation
On the CMP material removal at the molecular scale
L. Chang
Materials Research Institute (MRI)
Research output
:
Contribution to journal
›
Article
›
peer-review
18
Scopus citations
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'On the CMP material removal at the molecular scale'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Material Removal
100%
Molecular Scale
100%
Chemical Mechanical Polishing
100%
Polishing Material
100%
Order of Magnitude
50%
Debonding
50%
Credence
50%
Semiconductor Wafer
50%
Wafer Surface
50%
Chemical Mechanical Planarization
50%
Material Removal Mechanism
50%
Engineering
Material Removal
100%
Molecular Scale
100%
Chemical Mechanical Polishing
100%
Debonding
33%
Magnitude Calculation
33%
Material Science
Chemical Mechanical Planarization
100%
Debonding
33%