Abstract
Large power densities and increasing heat fluxes in microelectronics have resulted in the need for thermal enhancement strategies. Attachment of heat sinks has been shown to be a very cost effective heat removal technique. However, the design of heat sinks with multiple fins has been largely based on a make-and-test basis. Here, a design tool based on mathematical modelling and the use of optimization techniques is developed. The computer program can be used by designers to optimize the dimensions of the fins, assess the impact of increasing the number of fins or of many other parameters. The heat transfer coefficient is obtained using empirical correlations. A finite difference model has been developed, and the ellipsoid algorithm is used for optimization. Inputs to the program relate to the basic footprint of the heat sink: area, material properties, air flow and ambient temperatures, etc. The outputs are the fin height, width, spacing and minimized temperature distribution.
| Original language | English (US) |
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| Pages | 25-32 |
| Number of pages | 8 |
| State | Published - Dec 1 1994 |
| Event | Proceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA Duration: Nov 6 1994 → Nov 11 1994 |
Other
| Other | Proceedings of the 1994 International Mechanical Engineering Congress and Exposition |
|---|---|
| City | Chicago, IL, USA |
| Period | 11/6/94 → 11/11/94 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Mechanical Engineering