Optimization of electromagnetic coupling to ceramic resonators for magnetic resonance imaging applications

Matthew Pyrz, Michael T. Lanagan, Steven E. Perini, Thomas Neuberger, Fang Chen, Elena Semouchkina

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Research into the properties of dielectric resonators can provide insight to potential applications in magnetic resonance imaging (MRI) technology as replacements for the radiofrequency (RF) coils used in current designs. Increasing the strength of the external magnetic field offers several advantages, including improved signal-to-noise ratio (SNR) and spectral resolution. However, this increase in field strength may require an alternative coil design as traditional RF coils have numerous difficulties at higher frequencies such as low quality factor. A potential solution may be to replace these coils with dielectric resonators. The objective of this research project is aimed at gathering information pertinent to dielectric resonators with various boundary conditions. Specifically, probe design and alternative coupling methods were investigated using network analyzers to provide insight into methods that could increase power supplied to the resonator, allowing it to generate strong RF magnetic fields within MRI equipment. By implementing a full loop probe design around the ceramic resonator, the effective power transmission was increased by 70.6% to -9.60 dB in the experimental design and by 75.7% to -15.6 dB when it was used in the MRI probe. However, this strong increase in signal transmission, made possible through the replacement of the original 12 mm diameter coil, had unintentional consequences in that the resonant frequency could be tuned to a minimum of 605 MHz instead of the ideal 600 MHz. In order to correct for this, a thin plate of CaTiO3 was added to the side of the existing resonator disk to achieve a lower resonant frequency.

Original languageEnglish (US)
Title of host publication9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013
PublisherIMAPS-International Microelectronics and Packaging Society
Pages69-75
Number of pages7
ISBN (Print)9781629937182
StatePublished - 2013
Event9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013 - Orlando, FL, United States
Duration: Apr 23 2013Apr 25 2013

Publication series

Name9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013

Other

Other9th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2013
Country/TerritoryUnited States
CityOrlando, FL
Period4/23/134/25/13

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering

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