Abstract
The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 28-32 |
| Number of pages | 5 |
| Journal | Electronic manufacturing |
| Volume | 36 |
| Issue number | 3 |
| State | Published - Mar 1990 |
All Science Journal Classification (ASJC) codes
- General Engineering
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