Package Power Delivery Architecture for High Performance Computing Systems With a 1 kW IVR Operated in CCM-DCM Boundary Mode Condition

  • Ramin Rahimzadeh Khorasani
  • , Xingchen Li
  • , Joon Woo Kim
  • , Prahalad Murali
  • , Rohit Sharma
  • , Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

This paper investigates a package power delivery architecture for high-performance computing (HPC), incorporating a novel modular multi-phase integrated voltage regulator (IVR). The 1-kW 48-12/1 V architecture integrates an efficient interleaved buck-derived converter at the continuous-discontinuous boundary condition, facilitating parallel-connected networks of embedded inductors to deliver hundreds of amperes per phase. Due to the increased duty cycle and zero switching losses provided for the high side switch, the converter's frequency can be further increased up to 50 MHz with 8 parallel phases and 100 MHz with 16 parallel phases for a 48/1 V, 1 kW architecture. A conceptual 3-D stacked architecture using stacked glass substrates with flip chip GaN switches and embedded inductors, and capacitors is presented, offering a high-density single-stage 48-12/1 V IVR for the next generation of data center applications.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages285-292
Number of pages8
ISBN (Electronic)9798350375985
DOIs
StatePublished - 2024
Event74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, United States
Duration: May 28 2024May 31 2024

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference74th IEEE Electronic Components and Technology Conference, ECTC 2024
Country/TerritoryUnited States
CityDenver
Period5/28/245/31/24

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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