Packaging Approaches for mm Wave and Sub-THz Communication

This paper presents challenges, opportunities and approaches for packaging at THz frequencies. The two approaches discussed here are laminate based approach and Glass Panel Embedding (GPE). Laminate based solutions provide for low cost and reasonable performance but have challenges in terms of supporting low profile. This approach can be made effective and efficient by introducing air cavities in the laminate stack up to reduce losses, provided reliability can be addressed. Currently there are challenges in precisely structured air cavity fabrication for multi-layered substrates. Glass Panel Embedding (GPE) is a promising packaging approach for THz applications owing to its excellent dimensional stability and low profile. The GPE packaging approach using multiple dies can help support cavities, heterogeneous ICs such as PA and beamformer, interconnects, integrated phased array antennas and passives along with a robust thermal solution.