TY - GEN
T1 - Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization
AU - Yang, Xianbo
AU - Torun, Hakki M.
AU - Tang, Junyan
AU - Paladhi, Pavel Roy
AU - Zhang, Yanyan
AU - Becker, Wiren D.
AU - Hejase, Jose A.
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - This work realizes the parallelization of Bayesian Active Learning using Dropout (BAL-DO) and is successfully applied for optimizing equalization settings for high-speed channel receivers (RX). In this paper, parallel BAL-DO can achieve the largest horizontal eye (HEYE) opening and its corresponding equalization setting 12 times faster, on average, than the previously reported sequential BAL-DO. This corresponds to an average of 40-50 times faster than standard exhaustive time-domain simulations. Moreover, the HEYE prediction accuracy across the whole design space is close to 3 times better while using parallelization than sequential BAL-DO. With these outstanding results, parallel BAL-DO dramatically improves the efficiency for RX equalization optimization and greatly reduces the computing resources and time needed.
AB - This work realizes the parallelization of Bayesian Active Learning using Dropout (BAL-DO) and is successfully applied for optimizing equalization settings for high-speed channel receivers (RX). In this paper, parallel BAL-DO can achieve the largest horizontal eye (HEYE) opening and its corresponding equalization setting 12 times faster, on average, than the previously reported sequential BAL-DO. This corresponds to an average of 40-50 times faster than standard exhaustive time-domain simulations. Moreover, the HEYE prediction accuracy across the whole design space is close to 3 times better while using parallelization than sequential BAL-DO. With these outstanding results, parallel BAL-DO dramatically improves the efficiency for RX equalization optimization and greatly reduces the computing resources and time needed.
UR - http://www.scopus.com/inward/record.url?scp=85123195929&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85123195929&partnerID=8YFLogxK
U2 - 10.1109/EPEPS51341.2021.9609205
DO - 10.1109/EPEPS51341.2021.9609205
M3 - Conference contribution
AN - SCOPUS:85123195929
T3 - EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems
BT - EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021
Y2 - 17 October 2021 through 20 October 2021
ER -