Parasitic extraction and performance evaluation of a high I/O package

Rajagopal Subramanian; Madhavan Swaminathan; Moises Behar

Parasitic extraction and performance evaluation of a high I/O package

Rajagopal Subramanian, Madhavan Swaminathan, Moises Behar

Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

The parasitic extraction of a high I/O package using time domain reflectometry (TDR) measurement was discussed. The package that was considered was very small peripheral array (VSPA), a unique high I/O package due to 3D structure of the pins. The simulation of the equivalent model using SPICE showed a good agreement with the measurements indicating the accuracy of the method.

Original language	English (US)
Pages	99-106
Number of pages	8
State	Published - 1998
Event	Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98) - Singapore, Singapore Duration: Dec 8 1998 → Dec 10 1998

Conference

Conference	Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98)
City	Singapore, Singapore
Period	12/8/98 → 12/10/98

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

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title = "Parasitic extraction and performance evaluation of a high I/O package",

abstract = "The parasitic extraction of a high I/O package using time domain reflectometry (TDR) measurement was discussed. The package that was considered was very small peripheral array (VSPA), a unique high I/O package due to 3D structure of the pins. The simulation of the equivalent model using SPICE showed a good agreement with the measurements indicating the accuracy of the method.",

author = "Rajagopal Subramanian and Madhavan Swaminathan and Moises Behar",

year = "1998",

language = "English (US)",

pages = "99--106",

note = "Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98) ; Conference date: 08-12-1998 Through 10-12-1998",

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TY - CONF

T1 - Parasitic extraction and performance evaluation of a high I/O package

AU - Subramanian, Rajagopal

AU - Swaminathan, Madhavan

AU - Behar, Moises

PY - 1998

Y1 - 1998

N2 - The parasitic extraction of a high I/O package using time domain reflectometry (TDR) measurement was discussed. The package that was considered was very small peripheral array (VSPA), a unique high I/O package due to 3D structure of the pins. The simulation of the equivalent model using SPICE showed a good agreement with the measurements indicating the accuracy of the method.

AB - The parasitic extraction of a high I/O package using time domain reflectometry (TDR) measurement was discussed. The package that was considered was very small peripheral array (VSPA), a unique high I/O package due to 3D structure of the pins. The simulation of the equivalent model using SPICE showed a good agreement with the measurements indicating the accuracy of the method.

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UR - http://www.scopus.com/inward/citedby.url?scp=0032230424&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0032230424

SP - 99

EP - 106

T2 - Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98)

Y2 - 8 December 1998 through 10 December 1998

ER -

Parasitic extraction and performance evaluation of a high I/O package

Abstract

Conference

All Science Journal Classification (ASJC) codes

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