Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

Ki Jin Han; Madhavan Swaminathan

doi:10.1109/APMC.2008.4958466

Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

Ki Jin Han, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Original language	English (US)
Title of host publication	Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008
DOIs	https://doi.org/10.1109/APMC.2008.4958466
State	Published - 2008
Event	2008 Asia Pacific Microwave Conference, APMC 2008 - Hong Kong, China Duration: Dec 16 2008 → Dec 20 2008

Publication series

Name	Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008

Conference

Conference	2008 Asia Pacific Microwave Conference, APMC 2008
Country/Territory	China
City	Hong Kong
Period	12/16/08 → 12/20/08

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/APMC.2008.4958466

Cite this

@inproceedings{fab79d5bcb264e72afffdfd0f5595693,

title = "Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions",

author = "Han, {Ki Jin} and Madhavan Swaminathan",

year = "2008",

doi = "10.1109/APMC.2008.4958466",

language = "English (US)",

isbn = "9781424426423",

series = "Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008",

booktitle = "Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008",

note = "2008 Asia Pacific Microwave Conference, APMC 2008 ; Conference date: 16-12-2008 Through 20-12-2008",

}

Han, KJ & Swaminathan, M 2008, Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions. in Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008., 4958466, Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008, 2008 Asia Pacific Microwave Conference, APMC 2008, Hong Kong, China, 12/16/08. https://doi.org/10.1109/APMC.2008.4958466

Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions. / Han, Ki Jin; Swaminathan, Madhavan.
Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008. 2008. 4958466 (Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

AU - Han, Ki Jin

AU - Swaminathan, Madhavan

PY - 2008

Y1 - 2008

UR - http://www.scopus.com/inward/record.url?scp=69649105502&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=69649105502&partnerID=8YFLogxK

U2 - 10.1109/APMC.2008.4958466

DO - 10.1109/APMC.2008.4958466

M3 - Conference contribution

AN - SCOPUS:69649105502

SN - 9781424426423

T3 - Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008

BT - Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008

T2 - 2008 Asia Pacific Microwave Conference, APMC 2008

Y2 - 16 December 2008 through 20 December 2008

ER -

Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

Publication series

Conference

All Science Journal Classification (ASJC) codes

Access to Document

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Cite this