TY - GEN
T1 - Performance analysis of heat sinks designed for additive manufacturing
AU - White, Andrew Scott
AU - Saltzman, David
AU - Lynch, Stephen
N1 - Funding Information:
Thank you to the Penn State College of Engineering REU program, the Erickson Discovery Grant committee, and the Richard and Barbara Whitman Fund for the financial support. Thank you to GE and Penn State CIMP-3D for the expertise and assistance in manufacturing these prototypes. Thank you to InterPACK, GE, and the ASME K-16 Committee for organizing the competition that inspired this work.
Publisher Copyright:
Copyright © 2020 ASME.
PY - 2020
Y1 - 2020
N2 - Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.
AB - Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.
UR - http://www.scopus.com/inward/record.url?scp=85098324098&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85098324098&partnerID=8YFLogxK
U2 - 10.1115/IPACK2020-2532
DO - 10.1115/IPACK2020-2532
M3 - Conference contribution
AN - SCOPUS:85098324098
T3 - ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
BT - ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
PB - American Society of Mechanical Engineers
T2 - ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
Y2 - 27 October 2020 through 29 October 2020
ER -