Phonon heat conduction in Al1-xScxN thin films

C. Yuan, M. Park, Y. Zheng, J. Shi, R. Dargis, S. Graham, A. Ansari

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

Aluminum scandium nitride (Al1-xScxN) is regarded as a promising material for high-performance acoustic devices used in wireless communication systems. Phonon scattering and heat conduction processes govern the energy dissipation in acoustic resonators, ultimately determining their performance quality. This work reports on phonon scattering processes and thermal conductivity in Al1-xScxN alloys grown by molecular beam epitaxy with the Sc content (x) up to 0.26. The thermal conductivity shows a descending trend with increasing Sc content. Temperature-dependent measurements show an increase in thermal conductivity as the temperature increases at temperatures below 200 K, followed by a plateau at higher temperatures (T > 200 K). Application of an analytical Debye-Callaway model allows us to estimate the effects of boundary and alloy scattering on the observed thermal conductivity behavior. This work provides insight for phonon scattering mechanisms and the resultant thermal conductivity in Al1-xScxN, paving the way for future investigation of materials and design of acoustic devices.

Original languageEnglish (US)
Article number100498
JournalMaterials Today Physics
Volume21
DOIs
StatePublished - Nov 2021

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Energy (miscellaneous)
  • Physics and Astronomy (miscellaneous)

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