@inproceedings{2257ead11fba48cc880db867b2b90862,
title = "Photocurable dielectrics for electronic packaging and encapsulant applications",
author = "Wuttichai Reainthippayasakul and Qing Wang and Michael Lanagan",
year = "2016",
month = sep,
day = "16",
doi = "10.1109/3DPEIM.2016.7570556",
language = "English (US)",
series = "3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing",
address = "United States",
note = "1st International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2016 ; Conference date: 13-06-2016 Through 15-06-2016",
}