Simultaneous Switching Noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex due to the thousands of interconnects that need to be analyzed. This is because a system level modeling approach is necessary that combines the chip, package and board level interactions. This paper presents an efficient method to model the SSN for high speed systems by developing circuit models for the planes and interconnections that can be combined using superposition. This approximation is valid at frequencies where skin effect is dominant. Simulation results are compared with the measurements on a Test Vehicle, verifying the validity of the method.
|Original language||English (US)|
|Number of pages||9|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - 2000|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering