Plane stress fracture toughness of freestanding nanoscale thin films

H. Hosokawa, A. V. Desai, M. A. Haque

Research output: Contribution to journalArticlepeer-review

51 Scopus citations


Fracture toughness values of notched thin films were measured in-situ in the scanning electron microscope using a micro-machined experimental setup. Freestanding specimens, 200-300 nm thick, 2 μm wide and about 10 μm long, were fabricated from extruded gold micro-wire and sputtered aluminum films. The obtained values, 0.45 MPa m1/2 for gold and 0.51 MPa m1/2 for aluminum are on the same order of those for brittle materials. Such reduction in fracture toughness is discussed in light of reduced dislocation activities in the severely work hardened gold and dislocation starved aluminum specimens.

Original languageEnglish (US)
Pages (from-to)6444-6447
Number of pages4
JournalThin Solid Films
Issue number18
StatePublished - Jul 31 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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