TY - GEN
T1 - Polymeric substrate microcrystalline-silicon strain sensor
AU - Zhou, Lisong
AU - Jackson, Thomas Nelson
PY - 2004
Y1 - 2004
N2 - The microcrystalline-silicon (μC-Si) strain sensors fabricated directly on flexible polyimide substrates with similar gage factor were investigated. To maintain substrate flatness and provide improved thermal transfer during fabrication, a pressure-sensitive silicone gel adhesive layer was used to mount the Kapton® substrates onto glass carriers. An anisotropic conductive film was used to electrically connect the sample to a flexible cable which connects the strain sensors to a PC boards. Results show ∼0.85 gage factor, similar to metallic foil stain sensors, but with greatly reduced sensor area and power consumption.
AB - The microcrystalline-silicon (μC-Si) strain sensors fabricated directly on flexible polyimide substrates with similar gage factor were investigated. To maintain substrate flatness and provide improved thermal transfer during fabrication, a pressure-sensitive silicone gel adhesive layer was used to mount the Kapton® substrates onto glass carriers. An anisotropic conductive film was used to electrically connect the sample to a flexible cable which connects the strain sensors to a PC boards. Results show ∼0.85 gage factor, similar to metallic foil stain sensors, but with greatly reduced sensor area and power consumption.
UR - http://www.scopus.com/inward/record.url?scp=18044388167&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=18044388167&partnerID=8YFLogxK
U2 - 10.1109/DRC.2004.1367805
DO - 10.1109/DRC.2004.1367805
M3 - Conference contribution
AN - SCOPUS:18044388167
SN - 0780382846
T3 - Device Research Conference - Conference Digest, DRC
SP - 105
EP - 106
BT - Device Research Conference - Conference Digest, 62nd DRC
T2 - Device Research Conference - Conference Digest, 62nd DRC
Y2 - 21 June 2004 through 23 June 2004
ER -